Comprehensive Repair Guide for Large Arcade Machine Motherboards

by gzqldz3b5y on 2012-02-18 20:27:36

With the reform and opening-up of our country, large electronic arcade machines have developed rapidly, bringing along the problem of difficult repairs. Due to the conservatism in this technology, there has been no systematic motherboard repair guide until now. This book combines experience with theory, including instrument configuration, workbenches, adapter board production, wiring diagrams of various machines, and motherboard position markers, detailing the composition and structural principles of motherboards. It introduces 100 examples of repairing dead boards, mottled boards, operational faults, and SNK bases. It also explains methods to determine the quality of CPU, PLD, TTL, ROM, RAM components. The book is easy to understand, suitable for beginners and repair personnel for self-study. The 100 examples are practical experiences from the author's repair work, allowing users to apply them directly and solve problems quickly.

The author of this book is Mr. Li Junseng from Dalian Jiaheng Trading Co., Ltd.

Chapter One: Overview of Large Electronic Arcade Machine Working Systems

Section One: Hardware System

1. Host machine

2. Peripheral devices

Section Two: Software system of game consoles

Chapter Two: Basic Equipment and Usage Methods for Repairing Motherboards

Section One: Setup and Basic Configuration of Workshops

1. Power voltage issues

2. Grounding of workshop power supply

3. Relationship between electrostatic discharge phenomena and faults

Section Two: Workbench setup

1. Design of workbenches

2. Production of operation switch boxes

Section Three: Common testing instruments and equipment for motherboards

1. Logic test pen

2. Multimeter

3. Oscilloscope

4. Solder sucker

5. Microcomputer

6. Original encryption program

7. Jiaheng Repair Treasure - Game Console Repair Tester

8. Universal programmer

9. Introduction to some essential tools

Section Four: Self-made and improved tools

1. Wire checker

2. Integrated circuit pull-load pen

3. Pulse generator

Chapter Three: Numerical Concepts in Computers

Section One: Binary numbers

Section Two: Hexadecimal numbers

Section Three: Binary encoding

Chapter Four: Digital Circuit Basics

Section One: Circuit basics

Section Two: RC circuits

1. Charging and discharging of capacitors

2. Application of RC circuits on motherboards

Section Three: Logic gate circuits

1. Three logic states

2. Buffer

3. Inverter

4. AND gate

5. OR gate

6. XOR gate

7. NAND gate

8. NOR gate

9. XNOR gate

Section Four: Digital registers

1. R-S flip-flop

2. Basic flip-flop circuit

Section Five: TTL integrated circuits

1. Practical knowledge of TTL integrated circuits

2. Practical skills of TTL circuits

3. Electrostatic hazards and prevention during semiconductor device production and use

Chapter Five: Computer Basics

Section One: Basic structure of microcomputers

Section Two: Instruction programs and instruction systems

Section Three: Hardware structure of microcomputers

1. Structure of CPU

2. Memory

Chapter Six: 8-bit Microprocessor

Section One: 8-bit microprocessor

1. Structural characteristics of 8-bit microprocessors

2. Performance characteristics of 8-bit processors

Section Two: Z80 microprocessor

1. Performance characteristics of Z80

2. Internal structure of Z80

3. Definitions of Z80 chip leads

4. Addressing definitions of Z80

5. Instruction cycles of Z80

6. Fetch instruction operation code cycle

7. Read or write memory cycle

8. Input or output cycle

9. Interrupt request/response cycle

10. Non-maskable interrupt request cycle

11. Bus request/response cycle

12. Pause response cycle

13. Reset cycle

Section Three: 6502 microprocessor

1. Characteristics of 6502 microprocessor

2. Internal structure of 6502

3. Definitions of 6502 chip leads

4. Clock timing of 6502

5. Read timing of 6502 memory and peripherals

6. Write timing of 6502 memory and peripherals

Chapter Seven: MC68000 Microprocessor

Section One: Structure and performance of 16-bit microprocessors

1. Structural characteristics of 16-bit microprocessors

2. Performance characteristics of 16-bit microprocessors

3. Basic performance characteristics of MC68000

4. Internal structure of MC68000

5. Definitions of MC68000 chip leads

6. Addressing modes of MC68000

7. Bus cycles of MC68000

8. Read and write cycles

9. Read-modify-write cycle

10. Bus arbitration cycle

11. Timing of bus errors

12. Timing of pause operations

13. Timing of reset operations

Chapter Eight: How to Test Motherboards

Section One: Using the pull-load pen

1. Division of working areas for motherboard chips

2. Using the pull-line load pen to find faults caused by chip aging, speed, and poor drive capability

3. Using the pull-load pen to locate fault points

Section Two: Flexible use of oscilloscopes

1. Observation of transient, short-circuit, and open-circuit waveforms

2. Signal acquisition

Chapter Nine: Causes of Motherboard Failures

Section One: Faults caused by process issues

Section Two: Faults caused by component damage

Section Three: Software faults

Section Four: Faults caused by interference and noise

Section Five: Faults caused by design

Section Six: Human-induced faults

Chapter Ten: Conventional Maintenance Guide for Motherboards

Section One: Characteristics of motherboards

1. Microprocessor section

2. Active scene (foreground) synthesis circuit

3. Background synthesis circuit

4. Color circuit

5. Image program storage

6. Sound circuit

7. Servo circuit

8. Feature summary

Section Two: Introduction to common motherboard components

1. TTL components

2. Storage components

3. Programmable components

4. Central processing unit

5. Effectiveness

Section Three: Conventional diagnostic methods for motherboards

1. Connection observation method

2. Plug-in and removal method

3. Trial method

4. Exchange method

5. Comparison method

6. Static measurement method

7. Test instrument measurement

8. Principle analysis method

9. Heating and cooling method

10. Power pulling method

11. Segmentation method

Chapter Eleven: Composition Principles and Maintenance Methods for Sound Systems

Section One: Composition principles of sound systems

1. Bus structure

2. Z-80 chip selection

3. Sound reset circuit and function signals

4. 6295 sound processor

Section Two: Introduction to common motherboard components

1. TTL components

2. Storage components

3. Programmable components

4. Central processing unit

5. Effectiveness

Section Three: Conventional diagnostic methods for motherboards

1. Connection observation method

2. Plug-in and removal method

3. Trial method

4. Exchange method

5. Comparison method

6. Static measurement method

7. Test instrument measurement

8. Principle analysis method

9. Heating and cooling method

10. Power pulling method

11. Segmentation method

Chapter Twelve: Repair of Dead Boards

Section One: Basic hardware concepts

1. Bus concept

2. Tri-state bus

3. System bus

4. Input and output ports

5. Address decoding of multiple devices and memories

6. Address decoder

7. Linear selection decoder

8. Logic comparator decoder

9. Combinatorial logic decoder

10. I/O mapping decoder

11. Types of memory

12. ROM and RAM

Section Two: Core structure of motherboards

1. CPU bus structure

2. Pins and signals

3. Bus priority signals

Section Three: Bus operations

1. Data transfer operations

2. Bus arbitration

3. Bus error and shutdown operations

4. Relationship between DTACK, BERR, and HALT

5. Reset operations

Section Four: Exception handling

1. Introduction

2. Handling state

3. Privileged state

4. Exception handling

5. Specific process of exception handling

Section Five: CPU working waveform of motherboards

Section Six: Dead faults caused by reset circuits

1. Organizational principle of reset circuits

2. Inspection methods for reset circuits

3. Repair instances of RC circuits causing non-startup

Section Seven: Faults caused by clock circuits

Section Eight: Faults caused by monitored RAM and repair instances

Section Nine: Random dead faults caused by SRAM

Section Ten: Bus driving

1. Principle and structure of bus driving

2. Repair methods

3. Repair instances of drivers

4. Precautions

Section Eleven: Dead faults caused by PLD encryption components

1. Working principle and repair methods

2. Instances of dead faults caused by damaged PLDs

3. Regulations on the arrangement order of PLD encryption components

Section Twelve: Dead board faults caused by broken related lines of CPUs

1. Cause of fault

2. Repair instances of faults

Section Thirteen: Dead faults caused by damaged CPUs

1. Determining dead faults caused by CPUs

2. Inspection instances

Chapter Thirteen: Repair of Mottled Boards

Section One: Definition of mottled boards

Section Two: Causes of faults in mottled boards

1. Hardware faults

2. Software faults

Section Three: Inspection of faults in mottled boards

Section Four: Composition and inspection methods of color circuits

Section Five: Finding geometric distortion faults in background, midground, and foreground

Section Six: Repair instances of mottled boards

Chapter Fourteen: Operation faults

Section One: Composition and inspection methods of circuits

Section Two: Fault inspection instances

Chapter Fifteen: SNK card seat

Section One: Original SNK card seat

Section Two: Replicated SNK base

Section Three: SNK menu

Section Four: Repair instances of SNK base

Chapter Sixteen: Modifying TV as a tester display

Chapter Seventeen: Making standard board plugs and universal adapters

Section One: Connections of standard 28-pin plugs

Section Two: Adapters for other types of boards

Chapter Eighteen: Quick judgment method for motherboard components

Section One: Method for judging ineffective CPUs

1. MC68000, Z-80 CPUs

2. 70116 CPU

3. Familiarity with pin positions

Section Two: Judging M6295

Section Three: Power amplifier ICs

1. UPC1242

2. UPC1241

3. HA13001

Section Four: PLD encryption components

Section Five: Judging SRAM

Section Six: Judging PROM and EPROM

Section Seven: TTL circuit faults

1. Logical function errors

2. Poor chip speed

3. Chip breakdown

4. Poor chip drive capability

5. Other random faults

Section Eight: Common methods for checking chips

1. "Static" checks on board body and chips

2. Measurement of chip logical functions

Chapter Nineteen: Diagrams of IC pin functions

Section One: MC68000

Section Two: Z80

Section Three: 6502

Section Four: Other chips

1. M6295

2. YM2151

3. YM2149

4. YM2610

5. YM2203

6. Memory

Chapter Twenty: Common board wiring diagrams

Section One: Wiring diagram inside game consoles

Section Two: Wiring diagrams of various board connectors

1. Base Mahjong board connector wiring diagram

2. Uncontrolled console Mahjong board wiring diagram

3. Large Poker wiring diagram

4. Star 97 wiring diagram

5. Four-color Seven wiring diagram

6. Big Mary wiring diagram

7. HK Lucky Plaza wiring diagram

Chapter Twenty-One: Difficulty Password Adjustment

1. Electronic base

2. Large Poker

3. Uncontrolled console board

4. Star 97

5. Electronic base push-to-win

6. Four-color Seven

7. Yellow Gold push-to-win

8. Big Mary

9. Heaven Eye Open

10. Flying Heavenly Sword

11. Battle Wolf

12. New Three Kingdoms

13. Divine Carving

Chapter Twenty-Two: Diagrams of 54 Motherboards

Appendix One: List of software data for 153 motherboard PLDs and EPROMs

Appendix Two: Content Summary

This book combines theory with practice, introducing in an easy-to-understand manner the composition, structural principles, and functions of each part of game console motherboards. It includes instrument configurations, workbenches, wiring diagrams of various boards, difficulty adjustments, and board position markers, detailing methods to judge the quality of CPU, PLD, TTL, ROM, RAM components. It also covers repairs for dead boards, mottled boards, operational faults, sound parts, and SNK. Each part contains hundreds of examples, which are crystallizations of the author's repair experiences. These can be applied directly to quickly solve problems. The theoretical part mainly introduces digital circuits and theories relevant to motherboard repairs, as well as the working principles of microprocessors such as MC68000 and Z80. Additionally, it systematically introduces the pin function diagrams of commonly used game console motherboard components (including RAM, ROM, CPU, and interface circuits). It discusses in detail the central processing unit, interface circuits, minimum working systems, clock circuits, background circuits, foreground circuits, color output circuits, sound systems... combining principles with detailed introductions to the working principles of each part of the circuit.

Author Biography

Li Junseng graduated from university with a degree in computer science and later studied radio technology. He is currently the General Manager of Dalian Jiaheng Trading Co., Ltd. He has worked in automated instrumentation and radio design. He has attended numerous training sessions and summarized a set of rapid repair methods for game console motherboards. In early 1993, he first introduced "Large Arcade Machine Repair Materials" domestically, filling the gap of lacking specialized repair technical materials for domestic video games. In 1996, he published "Principles and Repairs of Large Arcade Machine Motherboards," and the same year, he issued the teaching VCD "Learn Motherboard Repair Easily" domestically. He successfully developed China's first dedicated game console repair equipment - Jiaheng Repair Treasure and professional game console motherboard teaching demonstration platforms.

Chapter One: Overview of Large Electronic Arcade Machine Working Systems

Section One: Basic Composition of Electronic Arcade Machines

Section Two: Basic Structure of Microcomputers

Section Three: Basic Composition of Game Consoles

Chapter Two: Basic Equipment and Usage Methods for Repairing Motherboards

Section One: Workshop Setup

Section Two: Repair Testing Instruments for Game Consoles

Section Three: Game Console Repair Tester - Jiaheng Repair Treasure

Chapter Three: Circuit Basics

Section One: Concepts of Numbers

Section Two: Logic Gate Circuits

Section Three: Triggers

Section Four: Sequential Logic Circuits

Section Five: Combinational Logic Circuits

Section Six: TTL Integrated Circuits

Chapter Five: Generation and Shaping of Pulse Waveforms

Section One: Overview

Section Two: Schmitt Trigger

Section Three: Monostable Trigger

Section Four: Astable Oscillator

Section Five: 555 Timer

Chapter Five: Memory

Section One: Read-Only Memory ROM

Section Two: Random Access Memory

Chapter Six: Programmable Logic Devices

Section One: Custom Integrated Circuits

Section Two: Programmable Logic Devices (PLD)

Chapter Seven: Microprocessors

Section One: 8-bit Microprocessors

Section Two: Z80 Microprocessors

Section Three: 6502 Microprocessors

Section Four: MC68000 Microprocessors

Chapter Eight: Conventional Maintenance Guide for Motherboards

Section One: Causes of Motherboard Faults

Section Two: Conventional Diagnostic Methods for Motherboards

Section Three: Structural Features of Motherboards

Section Four: Introduction to Commonly Used Components on Motherboards

Section Five: How to Test Motherboards

Chapter Nine: Composition Principles and Maintenance Methods for Sound Systems

Section One: Composition Principles of Sound Circuits

Section Two: Methods for Repairing Sound Circuits

Section Three: Eleven Actual Repair Examples

Section Four: Seven-step Method for Repairing Sound Systems

Chapter Ten: Repair of Dead Boards

Section One: Basic Concepts of Hardware

Section Two: Core Structure of Motherboards

Section Three: Dead Faults Caused by Reset Circuits

Section Four: Faults Caused by Clock Circuits

Section Five: Dead Faults Caused by Monitored RAM and Repair Examples

Section Six: Dead Faults Caused by Bus Drivers

Section Seven: Dead Faults Caused by PLD Encryption Components

Section Eight: Dead Faults Caused by Related Circuits of CPUs

Section Nine: Working Waveform of Motherboard CPUs

Section Ten: Ground Resistance at Board Ports

Chapter Eleven: Repair of Mottled Boards

Section One: Background Circuit

Section Two: Synthesis of Foreground Circuit

Section Three: Color Encoding Circuit

Section Four: Inspection of Mottled Boards

Chapter Twelve: Operational Faults

Section One: Faults Caused by Function Switches

Section Two: Inspection Examples of Operational Faults

Chapter Thirteen: SNK Card Seat

Section One: SNK Menu

Section Two: Repair Examples of SNK Base

Chapter Fourteen: Quick Judgment Method for Good/Bad Motherboard Components

Section One: Methods for Judging CPUs

Section Two: Identification of Memory

Section Three: Identification of Special Chips

Section Four: TTL Circuit Faults

Section Five: Common Methods for Checking Chips

Chapter Fifteen: Pin Function Diagrams of Relevant ICs

Section One: CPU Pin Functions

Section Two: Other Chips

Section Three: Memory

Chapter Sixteen: Rapid Repair of Popular Motherboards

Section One: Rich Man

Section Two: Uncontrolled Horse Board

Section Three: Fast Punch 2, 3rd Generation Concentrated Board

Section Four: Fast Punch 2, 3rd Generation Large Board

Section Five: Poker Square

Section Six: Round Table Warrior

Section Seven: Electronic Base

Section Eight: Fruit Machine

Section Nine: Star 97

Section Ten: Super Bingo Connect

Section Eleven: Racehorse Machine (Racing, Greyhound Racing, California Airship)

Section Twelve: Guess What

Section Thirteen: Dragon Tiger Ranking

Section Fourteen: SNK Base

Chapter Seventeen: Wiring Diagrams and Difficulty Adjustments for Common Models

Appendix: List of PLD, ROM Data for Motherboards

Since the reform and opening-up, China's electronic game industry has developed rapidly. However, up to now, there has been no complete manual for repairing electronic game consoles, providing a comprehensive introduction to the various integrated circuits used on today's motherboards, causing great inconvenience to the repair industry.

Our company has compiled this manual based on the needs of motherboard repairs. It is the first manual in China's repair industry about repairing electronic game console motherboards. This manual collects functional and lead-out diagrams of TTL74LS series integrated circuits, commonly used CPUs, MPUs, interface circuits, semiconductor memories, programmable logic devices, sound synthesizers, audio amplifiers, optocouplers, etc., and introduces in the last chapter of this manual, in the form of an appendix, the Chinese and English names, abbreviations, trademarks of more than 400 chip manufacturers for readers to consult.

The publication of this book provides a good technical reference for the game console repair industry and is an indispensable large technical toolbook for repair personnel.

Due to the limited level of the author, there may be inappropriate or erroneous places, and we sincerely ask readers to kindly point them out.

Catalogue Introduction

Chapter One: TTL Integrated Circuits

1. Overview

2. Precautions when using TTL circuits

3. Index table of TTL integrated circuits

4. Lead-out function diagram of TTL integrated circuits

Chapter Two: Several Common Microprocessors and Single-chip Microcomputer Integrated Circuits

1. Overview

2. Index table of microprocessors and single-chip microcomputer integrated circuits

3. Lead-out function diagram of microprocessors and single-chip microcomputer integrated circuits

Chapter Three: Interface Integrated Circuits

1. Overview

2. Index table of interface integrated circuits

Chapter Four: Semiconductor Memories

1. Overview

2. Index table of memory integrated circuits

3. Pin diagram and description of memory integrated circuits

Chapter Five: Programmable Logic Circuits

1. Overview

2. Index table of programmable logic devices

3. Pin diagram of programmable logic devices

Chapter Six: Sound Synthesis and Audio Amplifier Integrated Circuits

1. Index table of sound synthesis devices

2. Index table of audio amplifiers

3. Pin diagram of sound synthesis and audio amplifier integrated circuits

Chapter Seven: Optocouplers and Others

1. Index table of optocouplers

2. Index table of other ICs

3. Pin diagram of optocouplers and other ICs

Chapter Eight: Appendix

1. Correspondence of Chinese and English names, abbreviations, and trademarks of foreign manufacturers

2. Common English abbreviations, full forms, and Chinese references, translations in integrated circuits

Author Biography