Original article is from: Marking Machine Network http://www.technifor.cn/
YESTech has announced the launch of its latest M1 (TM) Automatic Optical Inspection (AOI) system. The system has been specially enhanced in design to address unique inspection challenges posed by advanced packaging, complex wire bonding, epoxy splashing, and shrinking component sizes.
The YESTech M1m features advanced high-speed device inspection capabilities with extremely high defect coverage. With a resolution of 3 million pixels, the M1m uses telecentric optics and Fusion Lighting (TM) patent technology to inspect wires, die attach, Surface Mount Technology (SMT) components and substrates, all within a footprint of less than one square meter. The M1m can be connected online or offline to wire bonders to support various types of bonders. Options include: automatic stock feeding/unloading devices, as well as top and bottom laser/ink marking machines. Users can quickly and intuitively program the M1m. By inputting Computer-Aided Design (CAD) data, a complete recipe can be developed in under an hour. The M1m uses standard SMT packaging libraries to simplify training and ensure programs are easy to deploy across all production lines. The "offline programming option" allows for the remote development of complete recipes without any impact on production.
The M1m has a small footprint of less than one square meter and offers options for automatic stock feeding/unloading devices, as well as top and bottom laser/ink marking machines. YESTech's offline programming software enables engineers to remotely program the system while the M1m continues executing production tasks. The system also comes standard with Statistical Process Control (SPC) data collection capabilities, which are available to all networked users.
Don Miller, President of YESTech, stated: "YESTech leverages years of accumulated experience in the field of automatic optical inspection to actively develop demanding applications for advanced packaging and microelectronics markets. We believe our systems will provide superior defect coverage and faster productivity, thereby further enhancing customer yield and return on investment."